| 11196165 |
Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications |
Siddharth K. Alur, Sheng Li |
2021-12-07 |
| 11195727 |
High density organic interconnect structures |
Siddharth K. Alur, Lilia May, Amanda E. Schuckman |
2021-12-07 |
| 11158558 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2021-10-26 |
| 11107757 |
Integrated circuit structures in package substrates |
Sanka Ganesan, William J. Lambert, Zhichao Zhang, Stephen Andrew Smith, Michael J. Hill +1 more |
2021-08-31 |
| 11004792 |
Microelectronic device including fiber-containing build-up layers |
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2021-05-11 |
| 10980129 |
Asymmetric electronic substrate and method of manufacture |
Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Sriram Srinivasan |
2021-04-13 |
| 10903137 |
Electrical interconnections with improved compliance due to stress relaxation and method of making |
Siddharth K. Alur |
2021-01-26 |