Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11195727 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman | 2021-12-07 | $28,128,000 |
| 11107780 | Pseudo-stripline using double solder-resist structure | Robert Alan May, Amruthavalli Pallavi Alur, Robert L. Sankman | 2021-08-31 | $22,590,000 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta +3 more | 2021-07-27 | $27,337,000 |