Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2021-10-26 |
| 11114353 | Hybrid microelectronic substrates | Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard C. Stamey | 2021-09-07 |
| 11107780 | Pseudo-stripline using double solder-resist structure | Lilia May, Robert Alan May, Robert L. Sankman | 2021-08-31 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Kristof Darmawikarta, Siddharth K. Alur +3 more | 2021-07-27 |
| 11043457 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2021-06-22 |
| 10998262 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Debendra Mallik | 2021-05-04 |
| 10980129 | Asymmetric electronic substrate and method of manufacture | Sri Chaitra Jyotsna Chavali, Wei-Lun Kane Jen, Sriram Srinivasan | 2021-04-13 |