Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205613 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Eng Huat Goh, Poh Boon Khoo | 2021-12-21 |
| 10998262 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2021-05-04 |
| 10923415 | Semiconductor package having integrated stiffener region | Eng Huat Goh, Min Suet Lim, Shawna M. Liff, Feras Eid | 2021-02-16 |