Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211714 | Slot antenna on a printed circuit board (PCB) | Min Suet Lim, Boon Ping Koh, Wil Choon Song, Khang Choong Yong | 2021-12-28 |
| 11205613 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Jiun Hann Sir, Poh Boon Khoo | 2021-12-21 |
| 11177226 | Flexible shield for semiconductor devices | Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim | 2021-11-16 |
| 11178768 | Flexible printed circuit EMI enclosure | Khang Choong Yong, Stephen H. Hall, Tin Poay Chuah, Boon Ping Koh | 2021-11-16 |
| 11172581 | Multi-planar circuit board having reduced z-height | Min Suet Lim, Tin Poay Chuah, Han Kung Chua | 2021-11-09 |
| 11133261 | Electronic device packaging | Min Suet Lim, Chee Kheong Yoon, Jia Yan Go | 2021-09-28 |
| 11114421 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Wee Hoe, Khang Choong Yong, Ping Ping Ooi | 2021-09-07 |
| 10998262 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Amruthavalli Pallavi Alur, Debendra Mallik | 2021-05-04 |
| 10943864 | Programmable redistribution die | Min Suet Lim, J-Wing Teh, Bok Eng Cheah | 2021-03-09 |
| 10923415 | Semiconductor package having integrated stiffener region | Jiun Hann Sir, Min Suet Lim, Shawna M. Liff, Feras Eid | 2021-02-16 |