| 11211714 |
Slot antenna on a printed circuit board (PCB) |
Min Suet Lim, Boon Ping Koh, Wil Choon Song, Khang Choong Yong |
2021-12-28 |
| 11205613 |
Organic mold interconnects in shielded interconnects frames for integrated-circuit packages |
Jiun Hann Sir, Poh Boon Khoo |
2021-12-21 |
| 11177226 |
Flexible shield for semiconductor devices |
Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim |
2021-11-16 |
| 11178768 |
Flexible printed circuit EMI enclosure |
Khang Choong Yong, Stephen H. Hall, Tin Poay Chuah, Boon Ping Koh |
2021-11-16 |
| 11172581 |
Multi-planar circuit board having reduced z-height |
Min Suet Lim, Tin Poay Chuah, Han Kung Chua |
2021-11-09 |
| 11133261 |
Electronic device packaging |
Min Suet Lim, Chee Kheong Yoon, Jia Yan Go |
2021-09-28 |
| 11114421 |
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization |
Wee Hoe, Khang Choong Yong, Ping Ping Ooi |
2021-09-07 |
| 10998262 |
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge |
Jiun Hann Sir, Poh Boon Khoo, Amruthavalli Pallavi Alur, Debendra Mallik |
2021-05-04 |
| 10943864 |
Programmable redistribution die |
Min Suet Lim, J-Wing Teh, Bok Eng Cheah |
2021-03-09 |
| 10923415 |
Semiconductor package having integrated stiffener region |
Jiun Hann Sir, Min Suet Lim, Shawna M. Liff, Feras Eid |
2021-02-16 |