Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11178768 | Flexible printed circuit EMI enclosure | Khang Choong Yong, Tin Poay Chuah, Boon Ping Koh, Eng Huat Goh | 2021-11-16 |
| 10886209 | Multiple-layer, self-equalizing interconnects in package substrates | Bok Eng Cheah, Chaitanya Sreerama, Jackson Chung Peng Kong | 2021-01-05 |