| 11205622 |
Stiffener shield for device integration |
Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah |
2021-12-21 |
| 11195801 |
Embedded reference layers for semiconductor package substrates |
Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Kooi Chi Ooi |
2021-12-07 |
| 11177226 |
Flexible shield for semiconductor devices |
Bok Eng Cheah, Eng Huat Goh, Khang Choong Yong, Min Suet Lim |
2021-11-16 |
| 11164827 |
Substrate with gradiated dielectric for reducing impedance mismatch |
Bok Eng Cheah, Ping Ping Ooi, Kooi Chi Ooi |
2021-11-02 |
| 11153968 |
Device, system and method to promote the integrity of signal communications |
Bok Eng Cheah, Khang Choong Yong, Yun Ling, Chia Voon Tan |
2021-10-19 |
| 11121074 |
Packaged die stacks with stacked capacitors and methods of assembling same |
Bok Eng Cheah, Mooi Ling Chang, Ping Ping Ooi, Wen Wei Lum |
2021-09-14 |
| 11049801 |
Encapsulated vertical interconnects for high-speed applications and methods of assembling same |
Bok Eng Cheah, Kooi Chi Ooi, Yang Liang Poh |
2021-06-29 |
| 11037874 |
Plane-less voltage reference interconnects |
Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim |
2021-06-15 |
| 10998261 |
Over-molded IC package with in-mold capacitor |
Bok Eng Cheah, Wen Wei Lum, Mooi Ling Chang, Ping Ping Ooi |
2021-05-04 |
| 10985147 |
Capacitors embedded in stiffeners for small form-factor and methods of assembling same |
Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Chin Lee Kuan |
2021-04-20 |
| 10978434 |
Systems in packages including wide-band phased-array antennas and methods of assembling same |
Bok Eng Cheah, Boon Ping Koh, Kooi Chi Ooi |
2021-04-13 |
| 10978407 |
Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same |
Bok Eng Cheah, Howard L. Heck, Seok Ling Lim, Jenny Shio Yin Ong |
2021-04-13 |
| 10980108 |
Multi-conductor interconnect structure for a microelectronic device |
Ping Ping Ooi, Bok Eng Cheah, Kooi Chi Ooi |
2021-04-13 |
| 10973116 |
3D high-inductive ground plane for crosstalk reduction |
Bok Eng Cheah, Khang Choong Yong, Ramaswamy Parthasarathy |
2021-04-06 |
| 10971440 |
Semiconductor package having an impedance-boosting channel |
Bok Eng Cheah, Khang Choong Yong, Po Yin Yaw, Kok Hou TEH |
2021-04-06 |
| 10964677 |
Electronic packages with stacked sitffeners and methods of assembling same |
Jenny Shio Yin Ong, Bok Eng Cheah, Seok Ling Lim, Kooi Chi Ooi |
2021-03-30 |
| 10957649 |
Overpass dice stacks and methods of using same |
Bok Eng Cheah, Min Suet Lim |
2021-03-23 |
| 10950552 |
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same |
Bok Eng Cheah, Kooi Chi Ooi, Paik Wen Ong |
2021-03-16 |
| 10943792 |
3D stacked-in-recess system in package |
Bok Eng Cheah, Min Suet Lim, Howe Yin Loo |
2021-03-09 |
| 10916524 |
Stacked dice systems |
Bok Eng Cheah, Kooi Chi Ooi, Ping Ping Ooi |
2021-02-09 |
| 10910325 |
Integrated circuit packages with conductive element having cavities housing electrically connected embedded components |
Seok Ling Lim, Jenny Shio Yin Ong, Bok Eng Cheah |
2021-02-02 |
| 10903142 |
Micro through-silicon via for transistor density scaling |
Bok Eng Cheah, Choong Kooi Chee, Tat Hin Tan, Wai Ling Lee |
2021-01-26 |
| 10903155 |
Vertical modular stiffeners for stacked multi-device packages |
Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim |
2021-01-26 |
| 10886209 |
Multiple-layer, self-equalizing interconnects in package substrates |
Stephen H. Hall, Bok Eng Cheah, Chaitanya Sreerama |
2021-01-05 |