Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049801 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-06-29 |
YP
Yang Liang Poh
Overall (2021): #204,786 of 548,734Top 40%
1
Patents 2021