Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11049801 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-06-29 | $34,663,000 |