Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195801 | Embedded reference layers for semiconductor package substrates | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2021-12-07 |
| 11164827 | Substrate with gradiated dielectric for reducing impedance mismatch | Jackson Chung Peng Kong, Bok Eng Cheah, Ping Ping Ooi | 2021-11-02 |
| 11049801 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Yang Liang Poh | 2021-06-29 |
| 11030012 | Methods and apparatus for allocating a workload to an accelerator using machine learning | Divya Vijayaraghavan, Denica N. Larsen, Lady Nataly Pinilla Pico, Min Suet Lim | 2021-06-08 |
| 10980108 | Multi-conductor interconnect structure for a microelectronic device | Ping Ping Ooi, Bok Eng Cheah, Jackson Chung Peng Kong | 2021-04-13 |
| 10978434 | Systems in packages including wide-band phased-array antennas and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Boon Ping Koh | 2021-04-13 |
| 10964677 | Electronic packages with stacked sitffeners and methods of assembling same | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim | 2021-03-30 |
| 10950552 | Ring-in-ring configurable-capacitance stiffeners and methods of assembling same | Jackson Chung Peng Kong, Bok Eng Cheah, Paik Wen Ong | 2021-03-16 |
| 10948915 | Computer-assisted or autonomous driving vehicle incident management method and apparatus | Shekoufeh Qawami, Casey Baron, Naissa Conde, Mengjie Yu | 2021-03-16 |
| 10916524 | Stacked dice systems | Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi | 2021-02-09 |