| 11195801 |
Embedded reference layers for semiconductor package substrates |
Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong |
2021-12-07 |
| 11164827 |
Substrate with gradiated dielectric for reducing impedance mismatch |
Jackson Chung Peng Kong, Bok Eng Cheah, Ping Ping Ooi |
2021-11-02 |
| 11049801 |
Encapsulated vertical interconnects for high-speed applications and methods of assembling same |
Bok Eng Cheah, Jackson Chung Peng Kong, Yang Liang Poh |
2021-06-29 |
| 11030012 |
Methods and apparatus for allocating a workload to an accelerator using machine learning |
Divya Vijayaraghavan, Denica N. Larsen, Lady Nataly Pinilla Pico, Min Suet Lim |
2021-06-08 |
| 10980108 |
Multi-conductor interconnect structure for a microelectronic device |
Ping Ping Ooi, Bok Eng Cheah, Jackson Chung Peng Kong |
2021-04-13 |
| 10978434 |
Systems in packages including wide-band phased-array antennas and methods of assembling same |
Bok Eng Cheah, Jackson Chung Peng Kong, Boon Ping Koh |
2021-04-13 |
| 10964677 |
Electronic packages with stacked sitffeners and methods of assembling same |
Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim |
2021-03-30 |
| 10950552 |
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same |
Jackson Chung Peng Kong, Bok Eng Cheah, Paik Wen Ong |
2021-03-16 |
| 10948915 |
Computer-assisted or autonomous driving vehicle incident management method and apparatus |
Shekoufeh Qawami, Casey Baron, Naissa Conde, Mengjie Yu |
2021-03-16 |
| 10916524 |
Stacked dice systems |
Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi |
2021-02-09 |