Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11164827 | Substrate with gradiated dielectric for reducing impedance mismatch | Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi | 2021-11-02 | $26,002,000 |
| 11121074 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Mooi Ling Chang, Jackson Chung Peng Kong, Wen Wei Lum | 2021-09-14 | $31,644,000 |
| 11114421 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Eng Huat Goh, Wee Hoe, Khang Choong Yong | 2021-09-07 | $31,495,000 |
| 10998261 | Over-molded IC package with in-mold capacitor | Jackson Chung Peng Kong, Bok Eng Cheah, Wen Wei Lum, Mooi Ling Chang | 2021-05-04 | $37,420,000 |
| 10980108 | Multi-conductor interconnect structure for a microelectronic device | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-04-13 | $58,007,000 |
| 10916524 | Stacked dice systems | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-02-09 | $44,388,000 |