Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121074 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Mooi Ling Chang, Ping Ping Ooi, Jackson Chung Peng Kong | 2021-09-14 |
| 10998261 | Over-molded IC package with in-mold capacitor | Jackson Chung Peng Kong, Bok Eng Cheah, Mooi Ling Chang, Ping Ping Ooi | 2021-05-04 |