Issued Patents 2021
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205622 | Stiffener shield for device integration | Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong | 2021-12-21 |
| 11195801 | Embedded reference layers for semiconductor package substrates | Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-12-07 |
| 11177226 | Flexible shield for semiconductor devices | Eng Huat Goh, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim | 2021-11-16 |
| 11164827 | Substrate with gradiated dielectric for reducing impedance mismatch | Jackson Chung Peng Kong, Ping Ping Ooi, Kooi Chi Ooi | 2021-11-02 |
| 11153968 | Device, system and method to promote the integrity of signal communications | Jackson Chung Peng Kong, Khang Choong Yong, Yun Ling, Chia Voon Tan | 2021-10-19 |
| 11121074 | Packaged die stacks with stacked capacitors and methods of assembling same | Mooi Ling Chang, Ping Ping Ooi, Jackson Chung Peng Kong, Wen Wei Lum | 2021-09-14 |
| 11049801 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Jackson Chung Peng Kong, Kooi Chi Ooi, Yang Liang Poh | 2021-06-29 |
| 11037874 | Plane-less voltage reference interconnects | Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2021-06-15 |
| 10998261 | Over-molded IC package with in-mold capacitor | Jackson Chung Peng Kong, Wen Wei Lum, Mooi Ling Chang, Ping Ping Ooi | 2021-05-04 |
| 10985147 | Capacitors embedded in stiffeners for small form-factor and methods of assembling same | Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong, Chin Lee Kuan | 2021-04-20 |
| 10978407 | Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same | Jackson Chung Peng Kong, Howard L. Heck, Seok Ling Lim, Jenny Shio Yin Ong | 2021-04-13 |
| 10978434 | Systems in packages including wide-band phased-array antennas and methods of assembling same | Jackson Chung Peng Kong, Boon Ping Koh, Kooi Chi Ooi | 2021-04-13 |
| 10980108 | Multi-conductor interconnect structure for a microelectronic device | Ping Ping Ooi, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-04-13 |
| 10971440 | Semiconductor package having an impedance-boosting channel | Jackson Chung Peng Kong, Khang Choong Yong, Po Yin Yaw, Kok Hou TEH | 2021-04-06 |
| 10973116 | 3D high-inductive ground plane for crosstalk reduction | Jackson Chung Peng Kong, Khang Choong Yong, Ramaswamy Parthasarathy | 2021-04-06 |
| 10964677 | Electronic packages with stacked sitffeners and methods of assembling same | Jenny Shio Yin Ong, Jackson Chung Peng Kong, Seok Ling Lim, Kooi Chi Ooi | 2021-03-30 |
| 10957649 | Overpass dice stacks and methods of using same | Min Suet Lim, Jackson Chung Peng Kong | 2021-03-23 |
| 10950552 | Ring-in-ring configurable-capacitance stiffeners and methods of assembling same | Jackson Chung Peng Kong, Kooi Chi Ooi, Paik Wen Ong | 2021-03-16 |
| 10943792 | 3D stacked-in-recess system in package | Min Suet Lim, Jackson Chung Peng Kong, Howe Yin Loo | 2021-03-09 |
| 10943864 | Programmable redistribution die | Eng Huat Goh, Min Suet Lim, J-Wing Teh | 2021-03-09 |
| 10916524 | Stacked dice systems | Jackson Chung Peng Kong, Kooi Chi Ooi, Ping Ping Ooi | 2021-02-09 |
| 10910325 | Integrated circuit packages with conductive element having cavities housing electrically connected embedded components | Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2021-02-02 |
| 10903155 | Vertical modular stiffeners for stacked multi-device packages | Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2021-01-26 |
| 10903142 | Micro through-silicon via for transistor density scaling | Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan, Wai Ling Lee | 2021-01-26 |
| 10886209 | Multiple-layer, self-equalizing interconnects in package substrates | Stephen H. Hall, Chaitanya Sreerama, Jackson Chung Peng Kong | 2021-01-05 |