Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11006514 | Three-dimensional decoupling integration within hole in motherboard | Jia Yan Go, Min Suet Lim, Tin Poay Chuah, Seok Ling Lim | 2021-05-11 |
| 10943792 | 3D stacked-in-recess system in package | Bok Eng Cheah, Min Suet Lim, Jackson Chung Peng Kong | 2021-03-09 |