Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133261 | Electronic device packaging | Eng Huat Goh, Min Suet Lim, Chee Kheong Yoon | 2021-09-28 |
| 11006514 | Three-dimensional decoupling integration within hole in motherboard | Min Suet Lim, Tin Poay Chuah, Seok Ling Lim, Howe Yin Loo | 2021-05-11 |