Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11178768 | Flexible printed circuit EMI enclosure | Khang Choong Yong, Stephen H. Hall, Boon Ping Koh, Eng Huat Goh | 2021-11-16 |
| 11172581 | Multi-planar circuit board having reduced z-height | Eng Huat Goh, Min Suet Lim, Han Kung Chua | 2021-11-09 |
| 11031359 | Capacitor loop structure | Jenny Shio Yin Ong, Chin Lee Kuan | 2021-06-08 |
| 11006514 | Three-dimensional decoupling integration within hole in motherboard | Jia Yan Go, Min Suet Lim, Seok Ling Lim, Howe Yin Loo | 2021-05-11 |
| 10939540 | Shielded folded circuit board | Yew San Lim, Boon Ping Koh, Phaik Kiau Tan | 2021-03-02 |