Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205622 | Stiffener shield for device integration | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong | 2021-12-21 |
| 11195801 | Embedded reference layers for semiconductor package substrates | Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-12-07 |
| 11158568 | Package with wall-side capacitors | Jenny Shio Yin Ong | 2021-10-26 |
| 11037874 | Plane-less voltage reference interconnects | Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong | 2021-06-15 |
| 11006514 | Three-dimensional decoupling integration within hole in motherboard | Jia Yan Go, Min Suet Lim, Tin Poay Chuah, Howe Yin Loo | 2021-05-11 |
| 10985147 | Capacitors embedded in stiffeners for small form-factor and methods of assembling same | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Chin Lee Kuan | 2021-04-20 |
| 10978407 | Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same | Jackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck, Jenny Shio Yin Ong | 2021-04-13 |
| 10964677 | Electronic packages with stacked sitffeners and methods of assembling same | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-03-30 |
| 10910325 | Integrated circuit packages with conductive element having cavities housing electrically connected embedded components | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong | 2021-02-02 |
| 10903155 | Vertical modular stiffeners for stacked multi-device packages | Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong | 2021-01-26 |