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Seok Ling Lim — 10 Patents in 2021

Intel: 10 patents #167 of 5,160Top 4%

Kampung Sungai Pau, MY: #1 of 2 inventorsTop 50%

Overall (2021): #7,639 of 548,734Top 2%

10 Patents 2021

Issued Patents 2021

Showing 1–10 of 10 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11205622	Stiffener shield for device integration	Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong	2021-12-21	$33,282,000
11195801	Embedded reference layers for semiconductor package substrates	Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi	2021-12-07	$28,128,000
11158568	Package with wall-side capacitors	Jenny Shio Yin Ong	2021-10-26	$21,268,000
11037874	Plane-less voltage reference interconnects	Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong	2021-06-15	$33,380,000
11006514	Three-dimensional decoupling integration within hole in motherboard	Jia Yan Go, Min Suet Lim, Tin Poay Chuah, Howe Yin Loo	2021-05-11	$38,242,000
10985147	Capacitors embedded in stiffeners for small form-factor and methods of assembling same	Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Chin Lee Kuan	2021-04-20	$53,056,000
10978407	Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same	Jackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck, Jenny Shio Yin Ong	2021-04-13	$58,007,000
10964677	Electronic packages with stacked sitffeners and methods of assembling same	Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi	2021-03-30	$32,599,000
10910325	Integrated circuit packages with conductive element having cavities housing electrically connected embedded components	Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong	2021-02-02	$28,243,000
10903155	Vertical modular stiffeners for stacked multi-device packages	Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong	2021-01-26	$50,999,000