Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic packages with stacked sitffeners and methods of assembling same

Electronic packages with stacked sitffeners and methods of assembling same

US Patent 10964677 · Granted Mar 30, 2021

Estimated economic value: $32,599,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertical interconnect design for improved electrical performance2025
Vertical interconnect design for improved electrical performance2025
Vertical interconnect design for improved electrical performance2025
Integrated bridge frame for package substrate2025
Integrated bridge frame for package substrate2025
Integrated bridge frame for package substrate2025
Integrated bridge frame for package substrate2025
Integrated bridge frame for package substrate2025
Recessed vertical interconnects for device miniaturization2025
Recessed vertical interconnects for device miniaturization2025
Asymmetrical laminated circuit boards for improved electrical performance2025
Asymmetrical laminated circuit boards for improved electrical performance2025