Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211714 | Slot antenna on a printed circuit board (PCB) | Eng Huat Goh, Boon Ping Koh, Wil Choon Song, Khang Choong Yong | 2021-12-28 |
| 11177226 | Flexible shield for semiconductor devices | Bok Eng Cheah, Eng Huat Goh, Jackson Chung Peng Kong, Khang Choong Yong | 2021-11-16 |
| 11172581 | Multi-planar circuit board having reduced z-height | Eng Huat Goh, Tin Poay Chuah, Han Kung Chua | 2021-11-09 |
| 11133261 | Electronic device packaging | Eng Huat Goh, Chee Kheong Yoon, Jia Yan Go | 2021-09-28 |
| 11030012 | Methods and apparatus for allocating a workload to an accelerator using machine learning | Divya Vijayaraghavan, Denica N. Larsen, Kooi Chi Ooi, Lady Nataly Pinilla Pico | 2021-06-08 |
| 11009890 | Computer-assisted or autonomous driving assisted by roadway navigation broadcast | Rajashree Baskaran, Maruti Gupta Hyde, Van H. Le, Hebatallah Saadeldeen | 2021-05-18 |
| 11006514 | Three-dimensional decoupling integration within hole in motherboard | Jia Yan Go, Tin Poay Chuah, Seok Ling Lim, Howe Yin Loo | 2021-05-11 |
| 10957649 | Overpass dice stacks and methods of using same | Bok Eng Cheah, Jackson Chung Peng Kong | 2021-03-23 |
| 10943864 | Programmable redistribution die | Eng Huat Goh, J-Wing Teh, Bok Eng Cheah | 2021-03-09 |
| 10943792 | 3D stacked-in-recess system in package | Bok Eng Cheah, Jackson Chung Peng Kong, Howe Yin Loo | 2021-03-09 |
| 10923415 | Semiconductor package having integrated stiffener region | Eng Huat Goh, Jiun Hann Sir, Shawna M. Liff, Feras Eid | 2021-02-16 |