Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903142 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan | 2021-01-26 |
WL
Wai Ling Lee
Overall (2021): #217,079 of 548,734Top 40%
1
Patents 2021