Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10903142 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan | 2021-01-26 | $50,999,000 |