Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107751 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Loke Yip Foo | 2021-08-31 |
| 10903142 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Jackson Chung Peng Kong, Tat Hin Tan, Wai Ling Lee | 2021-01-26 |