Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903142 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee | 2021-01-26 |
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Tat Hin Tan
Overall (2021): #239,335 of 548,734Top 45%
1
Patents 2021