Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11205613 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Jiun Hann Sir, Eng Huat Goh | 2021-12-21 | $33,282,000 |
| 10998262 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2021-05-04 | $37,420,000 |