| 11205589 |
Methods and apparatuses for forming interconnection structures |
He Ren, Hao Jiang, Mehul Naik, Srinivas D. Nemani |
2021-12-21 |
| 11145808 |
Methods for etching a structure for MRAM applications |
Jong Mun Kim, Minrui Yu, Chando Park, Mang-Mang Ling, Jaesoo Ahn +3 more |
2021-10-12 |
| 11114306 |
Methods for depositing dielectric material |
Bhargav S. Citla, Jethro Tannos, Jingyi Li, Douglas A. Buchberger, Jr., Zhong Qiang Hua +1 more |
2021-09-07 |
| 11114333 |
Method for depositing and reflow of a high quality etch resistant gapfill dielectric film |
Srinivas D. Nemani, Chentsau Ying |
2021-09-07 |
| 11049537 |
Additive patterning of semiconductor film stacks |
John O. Dukovic, Srinivas D. Nemani, Praburam Gopalraja, Steven Hiloong WELCH, Bhargav S. Citla |
2021-06-29 |
| 10998200 |
High pressure annealing process for metal containing materials |
Kaushal K. Singh, Mei-Yee Shek, Srinivas D. Nemani |
2021-05-04 |
| 10964527 |
Residual removal |
Jong Mun Kim, Biao Liu, Cheng Pan, Erica Chen, Chentsau Ying +1 more |
2021-03-30 |
| 10943779 |
Method and system for three-dimensional (3D) structure fill |
Ludovic Godet, Srinivas D. Nemani, Er-Xuan Ping, Gary E. Dickerson |
2021-03-09 |
| 10923367 |
Process chamber for etching low K and other dielectric films |
Dmitry Lubomirsky, Srinivas D. Nemani, Sergey G. Belostotskiy |
2021-02-16 |
| 10916426 |
Formation of crystalline, layered transition metal dichalcogenides |
Keith Tatseun Wong, Srinivas D. Nemani |
2021-02-09 |
