| 11205589 |
Methods and apparatuses for forming interconnection structures |
He Ren, Hao Jiang, Srinivas D. Nemani, Ellie Yieh |
2021-12-21 |
| 11164780 |
Process integration approach for selective metal via fill |
Shi YOU, He Ren, Yi Xu, Feng Chen |
2021-11-02 |
| 11101174 |
Gap fill deposition process |
Hao Jiang, Nikolaos Bekiaris, Erica Chen |
2021-08-24 |
| 11094588 |
Interconnection structure of selective deposition process |
Shi YOU, He Ren |
2021-08-17 |
| 11062942 |
Methods for controllable metal and barrier-liner recess |
He Ren, Amrita B. Mullick, Regina Freed, Uday Mitra |
2021-07-13 |
| 11043415 |
Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping |
Zhiyuan Wu, Nikolaos Bekiaris, Jin-Hee Park, Mark Lee |
2021-06-22 |
| 10957533 |
Methods for etching a structure for semiconductor applications |
Hao Jiang, He Ren, Hao Chen |
2021-03-23 |
| 10930472 |
Methods for forming a metal silicide interconnection nanowire structure |
Bencherki Mebarki, Annamalai Lakshmanan, Kaushal K. Singh, Andrew Cockburn, Ludovic Godet +1 more |
2021-02-23 |
| 10916433 |
Methods of forming metal silicide layers and metal silicide layers formed therefrom |
He Ren, Maximillian Clemons, Mei-Yee Shek, Minrui Yu, Bencherki Mebarki +2 more |
2021-02-09 |
