Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164780 | Process integration approach for selective metal via fill | He Ren, Mehul Naik, Yi Xu, Feng Chen | 2021-11-02 |
| 11094588 | Interconnection structure of selective deposition process | He Ren, Mehul Naik | 2021-08-17 |