Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205589 | Methods and apparatuses for forming interconnection structures | Hao Jiang, Mehul Naik, Srinivas D. Nemani, Ellie Yieh | 2021-12-21 |
| 11164780 | Process integration approach for selective metal via fill | Shi YOU, Mehul Naik, Yi Xu, Feng Chen | 2021-11-02 |
| 11094588 | Interconnection structure of selective deposition process | Shi YOU, Mehul Naik | 2021-08-17 |
| 11062942 | Methods for controllable metal and barrier-liner recess | Amrita B. Mullick, Regina Freed, Mehul Naik, Uday Mitra | 2021-07-13 |
| 11037825 | Selective removal process to create high aspect ratio fully self-aligned via | Amrita B. Mullick, Madhur Sachan, Swaminathan Srinivasan, Regina Freed, Uday Mitra | 2021-06-15 |
| 10957533 | Methods for etching a structure for semiconductor applications | Hao Jiang, Hao Chen, Mehul Naik | 2021-03-23 |
| 10916433 | Methods of forming metal silicide layers and metal silicide layers formed therefrom | Maximillian Clemons, Mei-Yee Shek, Minrui Yu, Bencherki Mebarki, Mehul Naik +2 more | 2021-02-09 |