Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171046 | Methods for forming cobalt and ruthenium capping layers for interconnect structures | Yufei Hu, Wenjing Xu, Gang Shen, Zhiyuan Wu, Tae Hong Ha | 2021-11-09 |
| 11164780 | Process integration approach for selective metal via fill | Shi YOU, He Ren, Mehul Naik, Yi Xu | 2021-11-02 |