Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171045 | Deposition of metal films with tungsten liner | Yu Lei, Sang-Hyeob Lee, Chris Pabelico, Yi Xu, Xianmin Tang +1 more | 2021-11-09 |
| 11171046 | Methods for forming cobalt and ruthenium capping layers for interconnect structures | Feng Chen, Yufei Hu, Wenjing Xu, Gang Shen, Zhiyuan Wu | 2021-11-09 |
| 10892186 | Integration of ALD copper with high temperature PVD copper deposition for BEOL interconnect | Ben-Li Sheu, Feng Q. Liu, Mei Chang, Shirish A. PETHE | 2021-01-12 |