Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171046 | Methods for forming cobalt and ruthenium capping layers for interconnect structures | Feng Chen, Yufei Hu, Gang Shen, Zhiyuan Wu, Tae Hong Ha | 2021-11-09 |
WX
Wenjing Xu
Overall (2021): #214,389 of 548,734Top 40%
1
Patents 2021