Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075165 | Methods and apparatus for forming dual metal interconnects | Suketu Arun Parikh, Rong Tao, Roey Shaviv, Joung Joo Lee, Seshadri Ganguli +3 more | 2021-07-27 |
| 10892186 | Integration of ALD copper with high temperature PVD copper deposition for BEOL interconnect | Ben-Li Sheu, Feng Q. Liu, Tae Hong Ha, Mei Chang | 2021-01-12 |