Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171141 | Gap fill methods of forming buried word lines in DRAM without forming bottom voids | Priyadarshi Panda, Sang Ho Yu, Sung-Kwan Kang, Gill Yong Lee, Sanjay Natarajan +2 more | 2021-11-09 |
| 11075165 | Methods and apparatus for forming dual metal interconnects | Suketu Arun Parikh, Rong Tao, Roey Shaviv, Joung Joo Lee, Shirish A. PETHE +3 more | 2021-07-27 |
| 11060188 | Selective deposition of aluminum oxide on metal surfaces | Sang Ho Yu | 2021-07-13 |
| 10930550 | Barrier for copper metallization and methods of forming | Sang Ho Yu, Lu Chen | 2021-02-23 |