Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10930550 | Barrier for copper metallization and methods of forming | Seshadri Ganguli, Sang Ho Yu | 2021-02-23 | $34,793,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10930550 | Barrier for copper metallization and methods of forming | Seshadri Ganguli, Sang Ho Yu | 2021-02-23 | $34,793,000 |