Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075165 | Methods and apparatus for forming dual metal interconnects | Suketu Arun Parikh, Roey Shaviv, Joung Joo Lee, Seshadri Ganguli, Shirish A. PETHE +3 more | 2021-07-27 |
RT
Rong Tao
Overall (2021): #281,097 of 548,734Top 55%
1
Patents 2021