Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114333 | Method for depositing and reflow of a high quality etch resistant gapfill dielectric film | Srinivas D. Nemani, Ellie Yieh | 2021-09-07 |
| 11056406 | Stack of multiple deposited semiconductor layers | Liyan Miao, Xinhai Han, Long-Shih Lin | 2021-07-06 |
| 10964527 | Residual removal | Jong Mun Kim, Biao Liu, Cheng Pan, Erica Chen, Srinivas D. Nemani +1 more | 2021-03-30 |