Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043457 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman | 2021-06-22 |