Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114388 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade | 2021-09-07 |
| 11056466 | Package on package thermal transfer systems and methods | Omkar G. Karhade, Christopher L. Rumer, Robert M. Nickerson | 2021-07-06 |