Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133263 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Shawna M. Liff | 2021-09-28 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Veronica Strong | 2021-08-24 |
| 11095012 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more | 2021-08-17 |
| 11031666 | Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric | Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff +3 more | 2021-06-08 |
| 11024933 | Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer | Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more | 2021-06-01 |
| 10998272 | Organic interposers for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Shawna M. Liff, Veronica Strong, Johanna M. Swan | 2021-05-04 |
| 10950919 | System comprising first and second servers interconnected by a plurality of joined waveguide sections | Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Aleksandar Aleksov +3 more | 2021-03-16 |