| 11133263 |
High-density interconnects for integrated circuit packages |
Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Shawna M. Liff |
2021-09-28 |
| 11101205 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Veronica Strong |
2021-08-24 |
| 11095012 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more |
2021-08-17 |
| 11031666 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric |
Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff +3 more |
2021-06-08 |
| 11024933 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer |
Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more |
2021-06-01 |
| 10998272 |
Organic interposers for integrated circuit packages |
Aleksandar Aleksov, Henning Braunisch, Shawna M. Liff, Veronica Strong, Johanna M. Swan |
2021-05-04 |
| 10950919 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections |
Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Aleksandar Aleksov +3 more |
2021-03-16 |