Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189580 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Krishna Bharath, Feras Eid, Johanna M. Swan, Aleksandar Aleksov | 2021-11-30 |
| 11147197 | Microelectronic package electrostatic discharge (ESD) protection | Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid | 2021-10-12 |
| 11133263 | High-density interconnects for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2021-09-28 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings | 2021-08-24 |
| 11049791 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Jimin Yao | 2021-06-29 |
| 11004618 | Capacitor with electrodes made of an interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2021-05-11 |
| 10998272 | Organic interposers for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Shawna M. Liff, Brandon M. Rawlings, Johanna M. Swan | 2021-05-04 |