Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133263 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2021-09-28 |
| 11108433 | Single side band transmission over a waveguide | Georgios Dogiamis, Jeff C. Morriss, Hyung-Jin Lee, Richard J. Dischler, Ajay Balankutty +2 more | 2021-08-31 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2021-08-24 |
| 11004824 | Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same | Adel A. Elsherbini, Javier Soto Gonzalez, Shawna M. Liff | 2021-05-11 |
| 10998272 | Organic interposers for integrated circuit packages | Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong, Johanna M. Swan | 2021-05-04 |
| 10992342 | Simplified multimode signaling techniques | Yidnekachew S. Mekonnen, Kemal Aygun | 2021-04-27 |
| 10971453 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Krishna Bharath, Javier Soto Gonzalez +1 more | 2021-04-06 |
| 10964992 | Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide | Georgios Dogiamis, Adel A. Elsherbini, Gilbert Dewey, Telesphor Kamgaing, Hyung-Jin Lee +1 more | 2021-03-30 |
| 10943851 | Reconstituted wafer assembly | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2021-03-09 |
| 10923429 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2021-02-16 |