Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923429 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Johanna M. Swan +1 more | 2021-02-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923429 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Johanna M. Swan +1 more | 2021-02-16 |