Issued Patents 2021
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211345 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Eyal Fayneh +2 more | 2021-12-28 |
| 11206008 | Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies | Georgios Dogiamis, Telesphor Kamgaing, Feras Eid, Vijay K. Nair | 2021-12-21 |
| 11205630 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more | 2021-12-21 |
| 11189585 | Selective recess of interconnects for probing hybrid bond devices | Brennen Mueller, Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Pooya Tadayon | 2021-11-30 |
| 11189580 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Krishna Bharath, Feras Eid, Aleksandar Aleksov, Veronica Strong | 2021-11-30 |
| 11183477 | Mixed hybrid bonding structures and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Nagatoshi Tsunoda, Jimin Yao | 2021-11-23 |
| 11158917 | Dual-substrate waveguide filter | Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Feras Eid | 2021-10-26 |
| 11147197 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid | 2021-10-12 |
| 11133263 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Shawna M. Liff | 2021-09-28 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2021-08-24 |
| 11095012 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more | 2021-08-17 |
| 11094672 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Adel A. Elsherbini, Shawna M. Liff, Patrick Morrow, Gerald Pasdast, Van H. Le | 2021-08-17 |
| 11062947 | Inorganic dies with organic interconnect layers and related structures | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Georgios Dogiamis | 2021-07-13 |
| 11049791 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Jimin Yao, Veronica Strong | 2021-06-29 |
| 11037892 | Substrate dielectric waveguides in semiconductor packages | Vijay K. Nair, Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Adel A. Elsherbini | 2021-06-15 |
| 11031666 | Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric | Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff +3 more | 2021-06-08 |
| 11024933 | Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer | Brandon M. Rawlings, Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing +3 more | 2021-06-01 |
| 11016288 | Adaptable displays using piezoelectric actuators | Sasha N. Oster, Feras Eid, Thomas L. Sounart, Aleksandar Aleksov, Shawna M. Liff +2 more | 2021-05-25 |
| 11011470 | Microelectronic package with mold-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing | 2021-05-18 |
| 10998879 | Monolithic die with acoustic wave resonators and active circuitry | Telesphor Kamgaing, Georgios Dogiamis, Feras Eid, Aleksandar Aleksov | 2021-05-04 |
| 10998302 | Packaged device with a chiplet comprising memory resources | Adel A. Elsherbini, Van H. Le, Shawna M. Liff, Patrick Morrow, Gerald Pasdast +1 more | 2021-05-04 |
| 10998272 | Organic interposers for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2021-05-04 |
| 10992016 | Multiplexer and combiner structures embedded in a mmwave connector interface | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis | 2021-04-27 |
| 10976822 | Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems | Georgios Dogiamis, Aleksandar Aleksov | 2021-04-13 |
| 10969576 | Piezo actuators for optical beam steering applications | Aleksandar Aleksov, Feras Eid, Sasha N. Oster, Shawna M. Liff, Thomas L. Sounart +2 more | 2021-04-06 |