Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189585 | Selective recess of interconnects for probing hybrid bond devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Johanna M. Swan, Shawna M. Liff, Pooya Tadayon | 2021-11-30 |
| 11056356 | Fluid viscosity control during wafer bonding | Daniel Pantuso, Mauro J. Kobrinsky, Chytra Pawashe, Myra McDonnell | 2021-07-06 |