Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11204555 | Method and apparatus to develop lithographically defined high aspect ratio interconnects | — | 2021-12-21 |
| 11189585 | Selective recess of interconnects for probing hybrid bond devices | Brennen Mueller, Adel A. Elsherbini, Mauro J. Kobrinsky, Johanna M. Swan, Shawna M. Liff | 2021-11-30 |
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Weihua Tang, Chandra Mohan Jha, Zhimin Wan | 2021-09-21 |
| 11061068 | Multi-member test probe structure | Justin Huttula | 2021-07-13 |
| 11024601 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly | 2021-06-01 |
| 10935573 | Slip-plane MEMS probe for high-density and fine pitch interconnects | Joe Walczyk | 2021-03-02 |