Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Chandra Mohan Jha | 2021-09-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Chandra Mohan Jha | 2021-09-21 |