Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Zhimin Wan | 2021-09-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Zhimin Wan | 2021-09-21 |