Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Zhimin Wan | 2021-09-21 | $30,488,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Zhimin Wan | 2021-09-21 | $30,488,000 |