| 11205630 |
Vias in composite IC chip structures |
Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more |
2021-12-21 |
$33,282,000 |
| 11189585 |
Selective recess of interconnects for probing hybrid bond devices |
Brennen Mueller, Mauro J. Kobrinsky, Johanna M. Swan, Shawna M. Liff, Pooya Tadayon |
2021-11-30 |
$30,212,000 |
| 11189580 |
Electrostatic discharge protection in integrated circuits |
Krishna Bharath, Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong |
2021-11-30 |
$30,212,000 |
| 11183477 |
Mixed hybrid bonding structures and methods of forming the same |
Shawna M. Liff, Johanna M. Swan, Nagatoshi Tsunoda, Jimin Yao |
2021-11-23 |
$33,627,000 |
| 11177912 |
Quantum circuit assemblies with on-chip demultiplexers |
Javier A. Falcon, Lester Lampert |
2021-11-16 |
$23,453,000 |
| 11147197 |
Microelectronic package electrostatic discharge (ESD) protection |
Veronica Strong, Johanna M. Swan, Aleksandar Aleksov, Feras Eid |
2021-10-12 |
$32,982,000 |
| 11095012 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Shawna M. Liff +3 more |
2021-08-17 |
$29,127,000 |
| 11094672 |
Composite IC chips including a chiplet embedded within metallization layers of a host IC chip |
Johanna M. Swan, Shawna M. Liff, Patrick Morrow, Gerald Pasdast, Van H. Le |
2021-08-17 |
$29,127,000 |
| 11049791 |
Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
Shawna M. Liff, Johanna M. Swan, Jimin Yao, Veronica Strong |
2021-06-29 |
$34,663,000 |
| 11037892 |
Substrate dielectric waveguides in semiconductor packages |
Vijay K. Nair, Sasha N. Oster, Johanna M. Swan, Telesphor Kamgaing, Georgios Dogiamis |
2021-06-15 |
$33,380,000 |
| 11031666 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric |
Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff, Aleksandar Aleksov +3 more |
2021-06-08 |
$26,946,000 |
| 11024933 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer |
Brandon M. Rawlings, Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing +3 more |
2021-06-01 |
$35,542,000 |
| 11004824 |
Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same |
Henning Braunisch, Javier Soto Gonzalez, Shawna M. Liff |
2021-05-11 |
$38,242,000 |
| 10998302 |
Packaged device with a chiplet comprising memory resources |
Van H. Le, Johanna M. Swan, Shawna M. Liff, Patrick Morrow, Gerald Pasdast +1 more |
2021-05-04 |
$37,420,000 |
| 10992021 |
Cross talk and interference reduction for high frequency wireless interconnects |
Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis |
2021-04-27 |
$44,593,000 |
| 10971453 |
Semiconductor packaging with high density interconnects |
Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more |
2021-04-06 |
$36,336,000 |
| 10971416 |
Package power delivery using plane and shaped vias |
Krishna Bharath, Mathew J. Manusharow, Mihir K. Roy, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more |
2021-04-06 |
$36,336,000 |
| 10959633 |
Wearable sensing patch technologies |
Amit S. Baxi, Vincent S. Mageshkumar, Sasha N. Oster, Aleksandar Aleksov, Feras Eid |
2021-03-30 |
$32,599,000 |
| 10964992 |
Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide |
Georgios Dogiamis, Henning Braunisch, Gilbert Dewey, Telesphor Kamgaing, Hyung-Jin Lee +1 more |
2021-03-30 |
$32,599,000 |
| 10950919 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections |
Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Brandon M. Rawlings, Aleksandar Aleksov +3 more |
2021-03-16 |
$38,556,000 |
| 10943851 |
Reconstituted wafer assembly |
Shawna M. Liff, Henning Braunisch, Johanna M. Swan |
2021-03-09 |
$45,039,000 |
| 10921524 |
Crimped mm-wave waveguide tap connector |
Georgios Dogiamis, Sasha N. Oster, Erich N. Ewy, Telesphor Kamgaing, Johanna M. Swan |
2021-02-16 |
$35,223,000 |
| 10921349 |
Piezoelectric package-integrated current sensing devices |
Georgios Dogiamis, Shawna M. Liff, Johanna M. Swan, Jelena Culic-Viskota, Thomas L. Sounart +2 more |
2021-02-16 |
$35,223,000 |
| 10903818 |
Piezoelectric package-integrated film bulk acoustic resonator devices |
Vijay K. Nair, Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Valluri Rao +1 more |
2021-01-26 |
$50,999,000 |
| 10897238 |
Piezoelectric package-integrated contour mode filter devices |
Feras Eid, Georgios Dogiamis, Valluri Rao, Johanna M. Swan, Telesphor Kamgaing +1 more |
2021-01-19 |
$115,732,000 |
