Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11205630 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Mauro Kobrinksy +1 more | 2021-12-21 | $33,282,000 |
| 11094672 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Patrick Morrow, Van H. Le | 2021-08-17 | $29,127,000 |
| 11003610 | Multichip package link | Zuoguo Wu, Mahesh Wagh, Debendra Das Sharma, Ananthan Ayyasamy, Xiaobel Li +2 more | 2021-05-11 | $38,242,000 |
| 10998302 | Packaged device with a chiplet comprising memory resources | Adel A. Elsherbini, Van H. Le, Johanna M. Swan, Shawna M. Liff, Patrick Morrow +1 more | 2021-05-04 | $37,420,000 |