Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11144492 | Flex bus protocol negotiation and enabling sequence | Debendra Das Sharma, Michelle C. Jen, Prahladachar Jayaprakash Bharadwaj, Bruce A. Tennant | 2021-10-12 |
| 11113225 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2021-09-07 |
| 11095556 | Techniques to support multiple protocols between computer system interconnects | Debendra Das Sharma, Michelle C. Jen, Mark S. Myers, Don Soltis, Ramacharan Sundararaman +1 more | 2021-08-17 |
| 11061761 | Multichip package link error detection | Venkatraman Iyer, Robert G. Blankenship, Zuoguo Wu | 2021-07-13 |
| 11003610 | Multichip package link | Zuoguo Wu, Debendra Das Sharma, Gerald Pasdast, Ananthan Ayyasamy, Xiaobel Li +2 more | 2021-05-11 |
| 10884195 | Techniques to support multiple interconnect protocols for a common set of interconnect connectors | Mark S. Myers, Stephen R. Van Doren, Dimitrios Ziakas, Bassam N. Coury | 2021-01-05 |