Venkatraman Iyer — 7 Patents at Intel

Issued Patents 2021

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11197322	Emulating collisions in wired local area networks and related systems, methods, and devices	Dixon Chen, John Junling Zang, Michael Rentschler	2021-12-07	$324,486,000
11113225	Extending multichip package link off package	Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Mohiuddin M. Mazumder, Jeff C. Morriss	2021-09-07	$31,495,000
11080212	High performance interconnect physical layer	Darren S. Jue, Jeff Willey, Robert G. Blankenship	2021-08-03	$25,424,000
11061761	Multichip package link error detection	Robert G. Blankenship, Mahesh Wagh, Zuoguo Wu	2021-07-13	$34,958,000
10963415	Bimodal PHY for low latency in high speed interconnects	William R. Halleck, Rahul R. Shah, Eric M. Lee	2021-03-30	$32,599,000
10931329	High speed interconnect with channel extension	Rahul R. Shah, William R. Halleck, Fulvio Spagna	2021-02-23	$31,062,000
10909055	High performance interconnect physical layer	Darren S. Jue, Robert G. Blankenship, Fulvio Spagna, Ashish Gupta	2021-02-02	$28,243,000