Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11197322 | Emulating collisions in wired local area networks and related systems, methods, and devices | Dixon Chen, John Junling Zang, Michael Rentschler | 2021-12-07 |
| 11113225 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Mohiuddin M. Mazumder, Jeff C. Morriss | 2021-09-07 |
| 11080212 | High performance interconnect physical layer | Darren S. Jue, Jeff Willey, Robert G. Blankenship | 2021-08-03 |
| 11061761 | Multichip package link error detection | Robert G. Blankenship, Mahesh Wagh, Zuoguo Wu | 2021-07-13 |
| 10963415 | Bimodal PHY for low latency in high speed interconnects | William R. Halleck, Rahul R. Shah, Eric M. Lee | 2021-03-30 |
| 10931329 | High speed interconnect with channel extension | Rahul R. Shah, William R. Halleck, Fulvio Spagna | 2021-02-23 |
| 10909055 | High performance interconnect physical layer | Darren S. Jue, Robert G. Blankenship, Fulvio Spagna, Ashish Gupta | 2021-02-02 |