Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11157350 | In-band margin probing on an operational interconnect | Daniel S. Froelich, Debendra Das Sharma, Per E. Fornberg, David Edward Bradley | 2021-10-26 |
| 10931329 | High speed interconnect with channel extension | Rahul R. Shah, William R. Halleck, Venkatraman Iyer | 2021-02-23 |
| 10909055 | High performance interconnect physical layer | Venkatraman Iyer, Darren S. Jue, Robert G. Blankenship, Ashish Gupta | 2021-02-02 |